Design II - Documents

In Design II, our team entered the next phase of this project: building the IoT Implementation for a Harsh Temperature Monitoring System device. We designed the PCB, established the firmware, manufactured the PCBs, soldered the components, tested the device, and ultimately, interfaced all moving parts to yield a successful product. In order for our device to meet all functional and customer requirements, many hours of testing, configuring, and revisions were made to achieve our final product. All costs of this device are recorded in our official BOM. More information on our device can be found in the downloadable documents below.